G9+

LED Packaging
H900
Product Features

1. High-precision LED chip lamp with special equipment, with special solidification equipment, can provide special whole line equipment and process plan;

2. Programmable suspension horizontal (X-direction) adaptive printing structure to ensure pressure stability;

3. Equipped with 1.3 million pixel digital camera, 10*8mm FOV field of view, perfectly compatible with all types/coating MARK;

4.GKG standard MES system can collect equipment parameters, debugging information, material monitoring and information capture, and realize the ability to control the output link in real time and comprehensively trace the production data.

Product Application

Suitable for outdoor advertising display, supermarket, hotel and other COB chip flexible lamp packaging field, compatible with solder paste and other multi-process.

Product Parameters
H900 Series
Maximum substrate size900mm*360mm (can be upgraded to 900*400mm)
Minimum substrate size80*50mm
Substrate thickness dimensions0.8 ~ 6 mm
Steel mesh frame dimensions720*300mm~1200*750mm
Transmission directionLeft in right out, right in left out, same in same out
Cleaning methodWet wipe, dry wipe
Power requirementAC:220 ±10%, 50/60Hz 2.2KW
Equipment sizeL1970mm*W1210mm*H1509mm(without tri-color light)