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Product Features
Product Application
Semiconductor
GD206
Product Features

1, the use of two-stage relay solid crystal single swing arm 180° rotation suction + gantry welding head mounting;

2, the use of double Wafer design, suitable for two kinds of material mounting, a high-precision mounting molding;

3, configure 6 inch iron ring (compatible with 6 inch crystal ring), with double ring correction function, greatly improve the precision of solid crystal;

4, the ability to achieve mounting accuracy precision mode ±10um&±1°, standard mode ±15um&±3°;

5, the use of online dispensing + solid crystal method of high-precision mounting process, product line flexible high-precision mounting;

6, suitable for a variety of practical functions, such as: welding head force control, scanning code function, Mapping to find crystals.

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Product Application

Mount equipment for semiconductor field, medical field, aerospace field, thermoelectric field, consumer electronics and other high-end fields.

Adaptive products: semiconductor field (multi-chip device packaging), TEC(cooling sheet) and other particle/chip products.

Product Parameters
GD206 automatic high speed solidification machine
Solid cycle≥450ms Precision mode: UPH4~6K/h  
         Standard mode: UPH6~8K/h
(Actual capacity depends on chip and substrate size and process requirements)
Solid position accuracyPrecision mode: ±10um
Standard mode: ±15um
Chip Angle accuracyPlus or minus 1 °
Chip size152.4*152.4-524*1524um
Applicable support sizeL: 120-200mm
W: 50-120mm
Equipment size (L*W*H)906 (front length)* 1200(side depth)*2013(height)mm